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Flip chip
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31	Embedding of Chips for System in Package realization – Technology and Applications Lars Boettcher 1, Dionysios Manessis 2, Andreas Ostmann 1 Stefan Karaszkiewicz 2 and Herbert Reichl 2 1 Fraunhofer Institute for Relia Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-05-06 04:02:53 Integrated circuits Semiconductor devices Electronics manufacturing Electrical engineering Semiconductor device fabrication Quad-flat no-leads package Printed circuit board Three-dimensional integrated circuit Flip chip Electronics Electromagnetism Electronic engineering
32	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M Fraunhofer IZM – ASSID All Silicon System Integration Dresden All Silicon System Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-05-05 17:47:15 Technology Three-dimensional integrated circuit Wafer Through-silicon via Fraunhofer Society Fraunhofer Group for Microelectronics Integrated circuit Flip chip Semiconductor device fabrication Electronics Microtechnology
33	UTAC Reflow Analysis Capability Thermal-Mechanical Simulation for Reflow Analysis Industry Add to Reading List Source URL: www.cadit.com.sg Language: English - Date: 2012-10-10 04:07:58 Manufacturing Reflow soldering Reflow oven Ansys Flip chip Reliability Thermal profiling Electronics manufacturing Electronic engineering Electronics
34	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M DEPARTMENT OF High Density Interconnect & Wafer Level Packaging Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-05-06 03:08:02 Technology Wafer-level packaging Microelectromechanical systems Wafer Three-dimensional integrated circuit Chip scale package Integrated circuit Flip chip Etching Semiconductor device fabrication Electronics Microtechnology
35	Datacon 2200 evoplus Innovative Solution for Innovative Products Future Proof Equipment The Datacon 2200 evopluss die bonder for Multi Module Attach Add to Reading List Source URL: www.besi.com Language: English - Date: 2014-12-11 08:35:25 Microtechnology Semiconductor devices Wafer Dual in-line package Light-emitting diode Flip chip Semiconductor device fabrication Electronic engineering Electronics
36	Microsoft Wordrevised Add to Reading List Source URL: rs.ieee.org Language: English - Date: 2011-06-08 19:43:14 Electronic engineering Ball grid array Solder Restriction of Hazardous Substances Directive Whisker Wave soldering Rework Flip chip Integrated circuit packaging Electronics manufacturing Electronics Chemistry
37	Investor Presentation Q4-2014 Add to Reading List Source URL: www.besi.com Language: English - Date: 2015-03-02 04:26:15 Semiconductor device fabrication Materials science Chemistry Flip chip Solder IDMS
38	F R A U N H O F E R I N S T I T U T E F O R R e l ia b i l it y an d M i c roin T e g ration I Z M Electronic Packaging & System Integration Invisible – Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-05-05 05:52:04 Technology Wafer bonding Integrated circuit packaging Reliability Flip chip Wafer Etching EV Group Three-dimensional integrated circuit Semiconductor device fabrication Microtechnology Electronics
39	A 128 × 128 × 24Gb/s Crossbar Interconnecting 128 tiles in a single hop and Occupying 6% of their area Giorgos Passas, Manolis Katevenis, and Dionisis Pnevmatikatos Inst. of Computer Science (ICS) Foundation for Resear Add to Reading List Source URL: www.ics.forth.gr Language: English - Date: 2014-02-26 11:59:50 Electronics Crossbar switch Clos network Cell Network On Chip Crossbar Flip-flop Crossbar latch Electronic engineering Electrical engineering Switches
40	J. Adhesion Sci. Technol., Vol. 17, No. 14, pp. 1923– ) Ó VSPAlso available online - www.vsppub.com Adhesion characteristics of under ll resins with ip chip package components Add to Reading List Source URL: www.dmsf.ust.hk Language: English - Date: 2004-03-16 02:05:35 Manufacturing Soldering Solder Printed circuit board Epoxy Flip chip Adhesion Semiconductor device fabrication Rework Electronics manufacturing Chemistry Electronics