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32![F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M Fraunhofer IZM – ASSID All Silicon System Integration Dresden
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34![F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M DEPARTMENT OF High Density Interconnect & Wafer Level Packaging F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M DEPARTMENT OF High Density Interconnect & Wafer Level Packaging](https://www.pdfsearch.io/img/f13d0da1d56492bf094608d06a3f3f08.jpg) | Add to Reading ListSource URL: www.izm.fraunhofer.deLanguage: English - Date: 2015-05-06 03:08:02
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35![Datacon 2200 evoplus Innovative Solution for Innovative Products Future Proof Equipment The Datacon 2200 evopluss die bonder for Multi Module Attach Datacon 2200 evoplus Innovative Solution for Innovative Products Future Proof Equipment The Datacon 2200 evopluss die bonder for Multi Module Attach](https://www.pdfsearch.io/img/b44bd4fba9f03396e80b0e170fab2330.jpg) | Add to Reading ListSource URL: www.besi.comLanguage: English - Date: 2014-12-11 08:35:25
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36![Microsoft Wordrevised Microsoft Wordrevised](https://www.pdfsearch.io/img/c1c6f56da0179818b3c98f61daab7d71.jpg) | Add to Reading ListSource URL: rs.ieee.orgLanguage: English - Date: 2011-06-08 19:43:14
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37![Investor Presentation Q4-2014 Investor Presentation Q4-2014](https://www.pdfsearch.io/img/dfd66b8aa3009e55973fe0b6040be9b3.jpg) | Add to Reading ListSource URL: www.besi.comLanguage: English - Date: 2015-03-02 04:26:15
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38![F R A U N H O F E R I N S T I T U T E F O R R e l ia b i l it y an d M i c roin T e g ration I Z M Electronic Packaging & System Integration
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39![A 128 × 128 × 24Gb/s Crossbar Interconnecting 128 tiles in a single hop and Occupying 6% of their area Giorgos Passas, Manolis Katevenis, and Dionisis Pnevmatikatos Inst. of Computer Science (ICS) Foundation for Resear A 128 × 128 × 24Gb/s Crossbar Interconnecting 128 tiles in a single hop and Occupying 6% of their area Giorgos Passas, Manolis Katevenis, and Dionisis Pnevmatikatos Inst. of Computer Science (ICS) Foundation for Resear](https://www.pdfsearch.io/img/235f2462f9cb81eef39574542e7491fa.jpg) | Add to Reading ListSource URL: www.ics.forth.grLanguage: English - Date: 2014-02-26 11:59:50
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40![J. Adhesion Sci. Technol., Vol. 17, No. 14, pp. 1923– ) Ó VSPAlso available online - www.vsppub.com Adhesion characteristics of under ll resins with ip chip package components J. Adhesion Sci. Technol., Vol. 17, No. 14, pp. 1923– ) Ó VSPAlso available online - www.vsppub.com Adhesion characteristics of under ll resins with ip chip package components](https://www.pdfsearch.io/img/e42ce0f1d541b73d0e2c15b6704d9dc3.jpg) | Add to Reading ListSource URL: www.dmsf.ust.hkLanguage: English - Date: 2004-03-16 02:05:35
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